The Diamond Wire Saw 3500 BASE is an entry-level yet exact diamond wire cutting machine designed for fine sectioning of delicate materials. Using a stainless steel wire set with diamonds, it delivers clean, accurate cuts while preserving the integrity of fragile samples.

Specially recommended for silicon wafers, glass, ceramics, and electronic components, the 3500 BASE operates at controlled low speeds to prevent overheating and structural stress. This ensures flat, burr-free surfaces with sharp edges, avoiding any modification to the material’s structure during cutting.

Key Features
• Cost-effective base model for fine cutting applications
• Stainless steel diamond wire for precision results
• Suitable for silicon, glass, ceramics, and electronics
• Low-speed operation prevents heat damage and sample distortion
• Produces clean, flat cuts with sharp edges
• Ideal for laboratories, research facilities, and electronic component testing

Specifications
• Type of Machine: Diamond wire saw

The Diamond Wire Saw 3500 BASE provides dependable performance and accuracy, making it a reliable solution for sample preparation, quality control, and research applications where precision cutting is essential.